The DRE-III multi-function fast thermal conductivity tester utilizes the transient plane heat source method (TPS technology) with Hot Disk probe for accurate thermal property measurements.

• Direct heat propagation measurement saves significant time
• Unaffected by contact thermal resistance issues common in static methods
• Minimal sample preparation required - only relatively flat surfaces needed for solids
• Custom test schemes and mathematical models for different material types
• Wide measurement range and fast testing speed

Standards Compliance: ISO 22007-2:2015, GB/T32064-2015

Metals, alloys, graphite, thermal conductive silicone grease, silica gel, silicone rubber, ceramics, geotechnical materials, rocks, polymers, paper, fabrics, foam plastics, concrete, composite boards, paper honeycomb boards, and other solids, powders, liquids, pastes, coatings, films, insulation materials, and anisotropic materials.

• Probe diameters available: Φ30mm, Φ15mm (standard), Φ7.5mm, Φ4mm
• Optional high/low temperature control box (-40 ~ 150°C) or vacuum test state
• Automatic testing software for rapid analysis and report generation
• Power requirements: AC 220V±10%, 50/60 Hz, <500W

• Heating material: Nickel
• Operating temperature: -50 ~ 150°C
• Maximum power: 20W
• Maximum voltage: 20V
• Maximum current: 1A
• Resistance: ~15Ω (marked on probe)
• Nickel wire specifications: 0.01mm thickness, 0.35±0.03mm width/spacing
• Protective layer: Polyimide film (Kapton), 0.06mm thickness
• Total probe thickness: 0.07±0.02mm (including bond layer)